SN74AUP1G80DRYR_TI(德州仪器)中文资料_英文资料_价格_PDF手册

SN74AUP1G80DRYR

低功耗单路正边沿触发式 D 型触发器

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1 Features

• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

• ESD Performance Tested Per JESD 22

– 2000-V Human-Body Model (A114-B, Class II)

– 1000-V Charged-Device Model (C101)

• Available in the Texas Instruments NanoStar™ Package

• Low Static-Power Consumption (ICC = 0.9 µA Maximum)

• Low Dynamic-Power Consumption (Cpd = 4.3 pF Typical at 3.3 V)

• Low Input Capacitance (Ci = 1.5 pF Typical)

• Low Noise

– Overshoot and Undershoot <10% of VCC

• Ioff Supports Partial-Power-Down Mode Operation

• Schmitt-Trigger Action Allows Slow Input Transition and Better Switching Noise Immunity at the Input (Vhys = 250 mV Typical at 3.3 V)

• Wide Operating VCC Range of 0.8 V to 3.6 V

• Optimized for 3.3-V Operation

• 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation

• tpd = 4.4 ns Maximum at 3.3 V

• Suitable for Point-to-Point Applications

2 Applications

• Home Automation

• Factory Automation

• Test and Measurement

• Enterprise Switching

• Telecom Infrastructure

• Personal Electronics

• White Goods

3 Description

The AUP family is TI s premier solution to the industry s low-power needs in battery-powered portable applications. This family assures a low staticand dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see AUP – The Lowest-Power Family). This product also maintains excellent signal integrity (see Excellent Signal Integrity).

This is a single positive-edge-triggered D-type flipflop. When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.