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SN74LVC3G17DCUR_TI(德州仪器)中文资料_英文资料_价格_PDF手册

2024/5/31 10:42:15

219

SN74LVC3G17DCUR

具有施密特触发输入的 3 通道、1.65V 至 5.5V 缓冲器

 

 

 

                                            更多技术详情请登录www.mroic.cn        

 


 

1 Features

 

• Available in the Texas Instruments NanoFree™ Package

• Supports 5-V VCC Operation

• Inputs Accept Voltages to 5.5 V

• Maximum tpd of 5.4 ns at 3.3 V

• Low Power Consumption, 10-μA Maximum ICC

• ±24-mA Output Drive at 3.3 V

• Typical VOLP (Output Ground Bounce)<0.8 V at VCC = 3.3 V, TA = 25°C

• Typical VOHV (Output VOH Undershoot)>2 V at VCC = 3.3 V, TA = 25°C

• Ioff Supports Live Insertion, Partial-Power-Down Mode and Back Drive Protection

• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

• ESD Protection Exceeds JESD 22

– 2000-V Human Body Model (A114-A)

– 200-V Machine Model (A115-A)

– 1000-V Charged-Device Model (C101)

 

 

 

 

 

2 Applications

 

• AV Receivers

• Audio Docks: Portable

• Blu-ray® Players and Home Theater

• MP3 Players/Recorders

• Personal Digital Assistants (PDAs)

• Power: Telecom/Server AC/DC Supply: Single Controller: Analog and Digital

• Solid State Drives (SSDs): Client and Enterprise

• TVs: LCD/Digital and High-Definition (HDTVs)

• Tablets: Enterprise

• Video Analytics: Server

• Wireless Headsets, Keyboards, and Mice

 

                                                      

 

3 Description

 

This triple Schmitt-trigger buffer is designed for 1.65-V to 5.5-V VCC operation.

 

The SN74LVC3G17 device contains three buffers and performs the Boolean function Y = A. The device functions as three independent buffers but, because of Schmitt action, it may have different input threshold evels for positive-going (VT ) and negative-going (VT– ) signals.

 

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

 

NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.