TLK1501IRCPG4

0.6Gbps 至 1.5Gbps 收发器

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· Hot Plug Protection

· 0.6 to 1.5 Gigabits Per Second (Gbps) Serializer/Deserializer

· High-Performance 64-Pin VQFP Thermally Enhanced Package (PowerPAD?)

· 2.5 V Power Supply for Low Power Operation

· Programmable Voltage Output Swing on Serial Output

· Interfaces to Backplane, Copper Cables, or Optical Converters

· Rated for Industrial Temperature Range

· On-Chip 8-Bit/10-Bit (8B/10B) Encoding/Decoding, Comma Alignment, and Link Synchronization

· On-Chip PLL Provides Clock Synthesis From Low-Speed Reference

· Receiver Differential Input Thresholds 200 mV Minimum

· Typical Power: 250 mW

· Loss of Signal (LOS) Detection

· Ideal for High-Speed Backplane Interconnect and Point-to-Point Data Link

Description

The TLK1501 is a member of the transceiver family of multigigabit transceivers used in ultrahigh-speed bidirectional point-to-point data transmission systems. The TLK1501 supports an effective serial interface speed of 0.6 Gbps to 1.5 Gbps, providing up to 1.2 Gbps of data bandwidth. The TLK1501 is pin-for-pin compatible with the TLK2500. The TLK1501 is both pin-for-pin compatible with and functionally identical to the TLK2501, a 1.6 to 2.5 Gbps transceiver, providing a wide range of performance solutions with no required board layout changes.

The primary application of this chip is to provide very high-speed I/O data channels for point-to-point baseband data transmission over controlled impedance media of approximately 50 ?. The transmission media can be printed-circuit board, copper cables, or fiber-optic cable. The maximum rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment.

This device can also be used to replace parallel data transmission architectures by providing a reduction in the number of traces, connector terminals, and transmit/receive terminals. Parallel data loaded into the transmitter is delivered to the receiver over a serial channel, which can be a coaxial copper cable, a controlled impedance backplane, or an optical link. It is then reconstructed into its original parallel format. It offers significant power and cost savings over current solutions, as well as scalability for higher data rate in the future.

The TLK1501 performs data conversion parallel-to-serial and serial-to-parallel. The clock extraction functions as a physical layer interface device. The serial transceiver interface operates at a maximum speed of 1.5 Gbps. The transmitter latches 16-bit parallel data at a rate based on the supplied reference clock (GTX_CLK). The 16-bit parallel data is internally encoded into 20 bits using an 8-bit/10-bit (8B/10B) encoding format. The resulting 20-bit word is then transmitted differentially at 20 times the reference clock (GTX_CLK) rate. The receiver section performs the serial-to-parallel conversion on the input data, synchronizing the resulting 20-bit wide parallel data to the extracted reference clock (RX_CLK). It then decodes the 20 bit wide data using 8-bit/10-bit decoding format resulting in 16 bits of parallel data at the receive data terminals (RXD0-15). The outcome is an effective data payload of 480 Mbps to 1.2 Gbps (16 bits data x the GTX_CLK frequency).

The TLK1501 is housed in a high performance, thermally enhanced, 64-pin VQFP PowerPAD package. Use of the PowerPAD package does not require any special considerations except to note that the PowerPAD, which is an exposed die pad on the bottom of the device, is a metallic thermal and electrical conductor. It is recommended that the TLK1501 PowerPAD be soldered to the thermal land on the board. All ac performance specifications in this data sheet are measured with the PowerPAD soldered to the test board.