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TXB0101DCKR_TI(德州仪器)中文资料_英文资料_价格_PDF手册

2024/5/31 11:33:14

277

TXB0101DCKR

具有自动方向感应和 /-15kV ESD 保护的 1 位双向电压电平转换器

 

 


                                                更多技术详情请登录www.mroic.cn        


 

1 Features

 

• Available in the Texas Instruments NanoFree™ Package

• 1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V on B Port (VCCA ≤ VCCB)

• VCC Isolation Feature

– If Either VCC Input is at GND, All Outputs are in the High-Impedance State

• OE Input Circuit Referenced to VCCA

• Low Power Consumption, 5 μA Maximum ICC

• Ioff Supports Partial-Power-Down Mode Operation

• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

• ESD Protection Exceeds JESD 22

– A Port – 2000 V Human Body Model (A114-B)

– 250 V Machine Model (A115-A)

– 1500 V Charged-Device Model (C101)

– B Port – 15 kV Human Body Model (A114-B)

– 250 V Machine Model (A115-A)

– 1500 V Charged-Device Model (C101)

 

 

 

 

2 Applications

 

• Handsets

• Smartphones

• Tablets

• Desktop PCs

 

 

                                      


3 Description

 

This 1-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA should not exceed VCCB.

 

When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.

 

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

 

To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

 

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.